A single ChatGPT inference task takes a GPU only 1 second, but a CPU takes 32 hours—this is not just a generational gap in computing power, but a watershed moment for critical infrastructure. As the number of parameters in large models grows exponentially, traditional data centers are facing core challenges such as heat dissipation bottlenecks, power redundancy, and long deployment cycles. The AI computing revolution calls for a complete restructuring of the entire chain from chips to systems, and the key to this transformation lies in the hands of innovators in critical infrastructure.
Recently, the “Boundless Thinking, Shared Future—2025 Vertiv Design Institute Summit Forum” was held in Zhengzhou. At the forum, Vertiv released its cutting-edge technology guide for intelligent computing infrastructure, providing authoritative guidance for the transformation of AIDCs, and also upgraded its Vertiv 360AI full-chain intelligent computing solution to accelerate the launch of the next-generation AI computing power factory.
A brand-new technical guide has been released, directly addressing the core issues of AIDC’s transformation.
Vertiv’s newly released cutting-edge technology guide covers cold chain, electric chain, and AI computing power planning, encompassing the entire lifecycle needs of AI data centers and forming the industry’s first complete methodology system.
AI Technology Guides Lead the Transformation of AI Data Centers. (NVIDIA GB300 NVL72 Reference Design Solution), (Infrastructure Critical Tasks: Solving the Core Challenges of AI Workload Management eBook), (Strategic Principles for Rational AI Transformation eBook), (White Paper on the Evolution of Intelligent Computing Center Infrastructure), providing a complete transformation path for AIDCs from chip technology roadmaps to future trends.
Cold Chain Technology Guides Break Through the High Heat Density Challenge. (White Paper on How Chilled Water Systems Meet Data Center Availability and Sustainability Goals), (White Paper on Data Center Liquid Cooling Deployment Solutions), combining cutting-edge application technologies and extensive practical applications to support the high-density heat dissipation challenges of AIDCs.
Power Chain Technology Guides Provide In-Depth Technical Resource Support. (From Grid to Chip: Data Center End-Chain Energy Management eBook), (White Paper on Intelligent Busbar Design for Data Center Terminal Power Distribution), focusing on technical bottlenecks and application pain points, building a full-chain power assurance system from grid access to chip power supply.
New Product Matrix Completely Upgraded: Supporting a Leap in AI Computing Power from All Angles
Vertiv’s 360AI end-to-end intelligent computing solution is designed by Vertiv to address complex high-density challenges. Through end-to-end integration, technological innovation, and ecosystem collaboration, it provides a “one-stop” solution for AI data centers to cope with explosive growth in computing power. This upgrade of multiple products at the cold chain and electricity chain levels accelerates the development of next-generation AI computing power factories.
•AI Cooling New Products–Taming the Heat Waves of Computing Power
Magnetic Levitation Black Technology–The Vertiv CoolLoop Chiller series offers oil-free, frictionless cooling for higher efficiency. The Vertiv CoolPhase Mesh magnetic levitation multi-unit system represents the pinnacle of air-cooling, achieving a PUE of 1.2.
High Heat Density Black Technology–Vertiv CoolChip CDU cold plate liquid cooling and Vertiv CoolLoop RDHx backplate air conditioning and thin-plate air walls achieve thorough cooling for liquid-cooled and air-cooled GPUs respectively.
•AI Power New Products–Stabilizing Every Watt
The Vertiv PowerUPS is a 9000 MW-class UPS power behemoth, with a single unit power of 1.25MW and a system power of 5MW, effectively handling increased power density and the over-power characteristics of AI loads. The Vertiv PowerDirect In-Rack rack power supply meets high-density power supply needs, pooled management, and ensures high efficiency and worry-free operation. The Vertiv PowerNexus prefabricated power modules reconfigure the power supply system, delivering double the power in a single day.
•New AI Micro-Modules–Integrated Cooling and Power Compatibility for 100+ Cards
Vertiv SmartArray’s thin-plate airflow wall solution is compatible with both air and liquid cooling, suitable for AI servers. Vertiv SmartRun’s modular prefabricated infrastructure supports megawatt-level computing power, enabling rapid deployment within one day.
•New AI Services–360 AI Full-Lifecycle Support
Vertiv’s 360 AI full-lifecycle integrated service provides end-to-end support from consultation and design to delivery and maintenance. Vertiv’s 360 AI full-lifecycle liquid cooling service covers Vertiv SFN engineering, solving fluid management and cleaning challenges.
“From chip to system, fully integrated, collaboratively evolving”—Vertiv is providing deterministic infrastructure support for the explosive growth of computing power through systematic infrastructure innovation, from technical theory to practical application, thus supporting the continuous leap forward of the AI industry.